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The sample below is for Thin Film Heads Principal Process Engineer Resume Sample. This resume was written by a ResumeMyCareer professional resume writer, and demonstrates how a resume for a Thin Film Heads Principal Process Engineer Resume Sample should properly be created. Our Certified Professional Resume Writers can assist you in creating a professional document for the job or industry of your choice. A professional resume writing service can significantly increase your changes of securing employment in a quick time manner.

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Accomplished and dynamic management professional with solid and diverse experience in the field of methods engineering, eager to contribute management and operational expertise towards supporting the organization in driving business growth and increasing bottom-line profits as a key team member with an extensive experience and recognized success in effective implementation of technical operations and processes to increase productivity of the team. Excellent analytical skills with keen attention to detail, ability to analyze situations, and research information to develop sound and ethical business solutions. Strategic thinker and results-oriented recognized ability to handle various organizational functions and lead productive teams in exceeding company goals. Enthusiastic individual and an excellent communicator, fluent in Portuguese and French, recognized ability to establish and maintain effective working relationships across cross-functional teams and diverse individuals at any levels and build strategic relationships with clients.

Core Competencies
Organizational Leadership • Operations Management • Team Management & Development • Technical Support
Strategic Planning & Execution • Research & Analysis • Process Improvement • Business Development

Digital Equipment Corporation, MA 7/1990 – Present
Thin Film Heads/Principal Process Engineer
Created and implemented process development in the plating and etch areas for new thin film head technology. Conducted research, handled purchasing and developed x-ray fluorescence system to measure thin film compositions and thickness on wafers. Spearheaded Scanning Electron Microscopy (SEM) lab and managed two technicians. Conducted thin film head failure analysis, accessed the results and prepared reports.
Digital Equipment Corporation, MA 8/1987 – 6/1990
Thin Film Heads Senior Process Engineer
Provided technical support to manufacturing plating, etch operations and chemical mix area. Facilitated activities and directed one junior level engineer and three technicians. Created strategic plans to address needs of business. Conducted experiments, analyzed results, and recommended process changes to minimize potential problems and improve product cost, performance, and efficiency. Defined equipment and implemented new processes to production. Ensured capacity needs are met to support production activities. Collaborated with vendors to identify potential alternative equipment. Conducted research and assessed equipment and process change to improve and reduce cycle time of plating and etch operations. Coordinated with corrective action teams, advanced manufacturing, engineering, maintenance, production and quality assurance for analyses and creating solutions. Executed and maintained statistical process control on all plating processes. Documented process specifications and procedures, provided technical and equipment support to the Chemical Mix area. Prepared capital acquisitions requests for process improvement and capacity for plating, etch, and chem. mix areas.
Texas Instruments, MA 8/1986 – 6/1987
Semiconductor Division Electronic Parts Department Process Plating Engineer
Provided technical support to three silver-plating semi-continuous lines for manufacturing of copper lead frames. Created process to eliminate surface corrosion of copper lead frames. Created strategic plans to improve process for silver-plating lines and optimizing chemicals and equipment. Developed cost reduction program for silver plated copper lead frames.
• Increased the yield and productivity of copper lead frame process.
• Improved the surface and quality of the silver plated copper lead frames.


Texas Instruments, MA 9/1984 – 7/1986
Semiconductor Division Electronic Parts Department Process/Quality Engineer

Texas Instruments, TX 9/1983 – 8/1984
Semiconductor Division Silicon Crystal Growth Process Engineer


Bachelor of Science in Chemical Engineering, 5/1983
Texas Tech University, Lubbock, TX

Special Computer Science Courses: Data Structure, Pascal Programming, and Assembly Programming Language

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